FeaturePak Embedded I/O Comes to SUMIT-ISM Stacks
1 year 9 months ago → New Products
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SUMIT/FeaturePak Adapter Board (click image to zoom)
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SUMIT/FP Adapter with Diamond's FP-DAQ1616 Module Attached (click image to zoom)
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Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today unveiled an adapter board that allows the use of FeaturePak I/O expansion modules in systems that provide SUMIT-ISM expansion stack locations.
The FeaturePak socket on the SUMIT/FP Adapter consumes a single PCI Express x1 lane from the SUMIT-A bus connector on the SUMIT-ISM module. The adapter provides a pair of 50-pin I/O header connectors for convenient access to all FeaturePak I/O. In addition, it includes pass-through connectors for the SUMIT-ISM stack’s SUMIT-B bus and PC/104 (ISA) bus. An extended operation temperature range of 40oC to +85oC is supported.
About the FeaturePak I/O Module Standard
The FeaturePak specification defines tiny, application-oriented personality modules – three-fifths the size of a credit card – that snap into low cost, low profile, highly reliable sockets on single board computers (SBCs), computer-on-module (COM) baseboards, and full-custom electronic circuit boards. FeaturePak modules interface to the host system via a single low cost, high density, 230-pin connector, which carries PCI Express, USB, I2C, and several other host-interface signals, plus up to 100 points of application I/O per module. The FeaturePak host interface is CPU agnostic and is compatible with both Intel- and RISC-architecture systems. Additionally, the modules can easily be integrated into embedded designs along with Qseven, COM Express, Mobile-ITX, SUMIT, PCI/104-Express, EBX, and EPIC. For more information, visit www.featurepak.org.
SUMIT/FP Adapter Pricing and Availability
Small quantities of the SUMIT/FP Adapter are available in 60 days, priced at $190.
Founded in 1989, Diamond Systems Corporation is a leading supplier of compact, rugged, wide-temperature embedded computing solutions for a wide range of applications in fixed and mobile environments. The company is the originator of the FeaturePak I/O modules standard, was an early adopter of PC/104 technology and today is one of the leading worldwide suppliers of embedded I/O modules and highly integrated single board computers combining CPU and data acquisition on a single board. Diamond’s extensive product line includes A/D, D/A, digital I/O, serial communications, wired and wireless networking, and power supply modules as well as single-board computers and enclosures. Diamond also offers a full range of system solutions, including the capability to customize boards or systems to meet the needs of a particular application. The privately held company is based in Mountain View, California, in the heart of Silicon Valley. For more information, visit www.diamondsystems.com or call 1-800-36-PC104.
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Source: Diamond Systems
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